US Patent Issued to GLOBALFOUNDRIES SingaporePte. on June 17 for "Interconnection for monolithically integrated stacked devices and methods of forming thereof" (Singaporean Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,189, issued on June 17, was assigned to GLOBALFOUNDRIES SingaporePte. Ltd. (Singapore).

"Interconnection for monolithically integrated stacked devices and methods of forming thereof" was invented by You Qian (Singapore) and Rakesh Kumar (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A monolithic integrated device may include a first device having a complementary metal-oxide-semiconductor (CMOS) substrate, and a second device arranged over the CMOS substrate. The second device may include a first conductive element, and a second conductive element arranged over the first conductive element. A via opening may extend through the first conduc...