ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,111, issued on June 24, was assigned to GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore).
"Crackstop structures" was invented by Ranjan Rajoo (Singapore), Frank G. Kuechenmeister (Dresden, Germany) and Dirk Breuer (Dresden, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to semiconductor structures, and more particularly, to crackstop structures and methods of manufacture. The structure includes: a die matrix comprising a plurality of dies separated by at least one scribe lane; and a crackstop structure comprising at least one line within the at least one scribe lane between adjacent dies of the plurality of dies...