ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,776, issued on June 10, was assigned to GlobalFoundries Singapore Pte. Ltd. (Singapore).
"Heat sink for face bonded semiconductor device" was invented by Rui Tze Toh (Singapore), Anupam Dutta (Kolkata, India), Oscar D. Restrepo (Halfmoon, N.Y.), Vibhor Jain (Clifton Park, N.Y.), Vvss Satyasuresh Choppalli (Bengaluru, India), John J. Pekarik (Underhill, Vt.) and Alexander Derrickson (Malta, N.Y.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first substrate, a second substrate bonded to the first substrate, and at least one thermally conductive structure that extends through a portion of the first substrate and a por...