ALEXANDRIA, Va., June 6 -- United States Patent no. 12,284,924, issued on April 22, was assigned to GLOBALFOUNDRIES Singapore Pte. Ltd. (Singapore).
"Programmable interposer using RRAM platform" was invented by Lup San Leong (Singapore), Juan Boon Tan (Singapore), Benfu Lin (Singapore) and Yi Jiang (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "According to various embodiments, there may be provided an interposer. The interposer including: a substrate; a dielectric layer disposed on the substrate; a via disposed entirely within the dielectric layer; a resistive film layer disposed to line the via; a metal interconnect disposed in the resistive layer lined via; and a plurality of metal lines dispos...