ALEXANDRIA, Va., June 5 -- United States Patent no. 12,278,029, issued on April 15, was assigned to GLOBALFOUNDRIES Singapore Pte. Ltd (Singapore).
"Heat dissipating structures" was invented by Yudi Setiawan (Singapore), Handoko Linewih (Singapore) and Siow Lee Chwa (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to semiconductor structures and, more particularly, to heat dissipating structures and methods of manufacture. The structure includes: a thin film resistor within a back end of the line structure; and a heat dissipating structure below the thin film resistor, the heat dissipating structure includes a top plate with a slotted configuration and being within the...