US Patent Issued to Global Unichip, Taiwan Semiconductor Manufacturing on Oct. 7 for "Communication system between dies and repairing method for lanes between dies" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,654, issued on Oct. 7, was assigned to Global Unichip Corp. (Hsinchu, Taiwan) and Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Communication system between dies and repairing method for lanes between dies" was invented by Igor Elkanovich (Hsinchu, Taiwan), Yung-Sheng Fang (Hsinchu, Taiwan) and Pei Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The disclosure provides a communication system between dies and a repairing method for lanes between dies. The communication system includes a transmitting device disposed on a first die and a receiving device disposed on a second die. During the transmission process in wh...