US Patent Issued to GLOBAL UNICHIP, TAIWAN SEMICONDUCTOR MANUFACTURING on Oct. 14 for "Circuit board device and its circuit module" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,446,145, issued on Oct. 14, was assigned to GLOBAL UNICHIP Corp. (Hsinchu, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Circuit board device and its circuit module" was invented by Huan-Yi Liao (Hsinchu, Taiwan), Sheng-Fan Yang (Hsinchu, Taiwan), Chi-Lou Yeh (Hsinchu, Taiwan) and Zhong-Yan You (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board device includes a multilayer board structure, a main ground and a circuit module. The main ground is configured in the multilayer board structure. The circuit module includes two differential-signal portions. These differential-signal portions are all...