US Patent Issued to GLOBAL UNICHIP, TAIWAN SEMICONDUCTOR MANUFACTURING on Jan. 13 for "Semiconductor packaging device and heat dissipation cover thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,502, issued on Jan. 13, was assigned to GLOBAL UNICHIP Corp. (Hsinchu, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Semiconductor packaging device and heat dissipation cover thereof" was invented by Sheng-Fan Yang (Hsinchu, Taiwan), Yen-Chao Lin (Hsinchu, Taiwan) and Chi-Ming Yang (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor packaging device includes a packaging module, a heat dissipation cover and a thermal interface material layer. The package module includes a substrate, and a working chip mounted on the substrate. The heat dissipation cover includes a metal cover fixed on the ...