US Patent Issued to GLOBAL UNICHIP, TAIWAN SEMICONDUCTOR MANUFACTURING on Dec. 23 for "Interposer device and semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,057, issued on Dec. 23, was assigned to GLOBAL UNICHIP Corp. (Hsinchu, Taiwan) and TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Interposer device and semiconductor package structure" was invented by Hao-Yu Tung (Hsinchu, Taiwan), Sheng-Fan Yang (Hsinchu, Taiwan), Hung-Yi Chang (Hsinchu, Taiwan), Yi-Tzeng Lin (Hsinchu, Taiwan), Wei-Chiao Wang (Hsinchu, Taiwan) and Wei-Hsun Liao (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interposer device comprises two bump regions, a channel region, a plurality of signal lines and a plurality of ground lines. The two bump regions are respectively coupled to two semicondu...