US Patent Issued to GLOBAL COMMUNICATION SEMICONDUCTORS on June 10 for "Bulk acoustic wave resonator with improved structures" (California Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,329,035, issued on June 10, was assigned to GLOBAL COMMUNICATION SEMICONDUCTORS LLC (Torrance, Calif.).

"Bulk acoustic wave resonator with improved structures" was invented by Liping D. Hou (Torrance, Calif.) and Shing-Kuo Wang (Torrance, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A bulk acoustic wave resonator includes a substrate, and a stack that is supported by the substrate. The stack includes a first electrode, a multilayer buffer, a piezoelectric layer, and a second electrode. The multilayer buffer is disposed between the first electrode and the piezoelectric layer, and the piezoelectric layer is disposed between the multilayer buffer ...