US Patent Issued to GIGA-BYTE TECHNOLOGY on Nov. 18 for "Heat dissipation assembly and electric device thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,477,693, issued on Nov. 18, was assigned to GIGA-BYTE TECHNOLOGY Co. LTD. (New Taipei, Taiwan).

"Heat dissipation assembly and electric device thereof" was invented by Chih-Ming Lai (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation assembly and an electric device thereof are provided. An expansion card is fixed in the electric device. The heat dissipation assembly includes a heat dissipation unit and a quick release hook. A first guide block is provided on a first side of the heat dissipation unit, and a first positioning component is provided on the first guide block. The quick release hook includes a slide piece, a ...