ALEXANDRIA, Va., Nov. 11 -- United States Patent no. 12,471,253, issued on Nov. 11, was assigned to GETAC TECHNOLOGY Corp. (New Taipei, Taiwan).
"Heat dissipation structure and electronic device" was invented by Hao-Wei Chan (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation structure includes a housing, a heat conduction sheet and a thin film. The housing includes a wall surface, which includes an accommodating groove, a supporting surface and an inclined surface. The accommodating groove is recessed on the supporting surface. The inclined surface is connected to the supporting surface, and is located on one side of the accommodating groove. The heat conduction sheet is accomm...