US Patent Issued to Getac Technology on May 20 for "Electronic device assembly, expansion component thereof, and heat dissipation module" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,963, issued on May 20, was assigned to Getac Technology Corp. (New Taipei, Taiwan).

"Electronic device assembly, expansion component thereof, and heat dissipation module" was invented by Jui-Lin Yang (Taipei, Taiwan), Wan-Lin Hsu (Taipei, Taiwan), Hsin-Chih Chou (Taipei, Taiwan), Kun-Cheng Lee (Taipei, Taiwan) and Juei-Chi Chang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module includes a diversion case and a fan. The diversion case includes an input section, an output section, and a connecting section that connects the input section and the output section, where an angle is defined between an extending directi...