US Patent Issued to Georgia Tech Research on Sept. 23 for "Electrical structure with non-linear electrical interconnect" (Georgia Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,426,159, issued on Sept. 23, was assigned to Georgia Tech Research Corp. (Atlanta).

"Electrical structure with non-linear electrical interconnect" was invented by Michael D. Grady (Smyrna, Ga.) and Mark M. Bolding (Atlanta).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a 3D-printed electrical structure such as an electromagnetic bandgap is provided. The structure includes a dielectric material with an embedded electrical interconnect that functions like a via and electrically connects a first surface of the dielectric material with a second surface of the dielectric material such as a ground plane. Unlike conventional vias, the embedd...