US Patent Issued to Georgia Tech Research on May 27 for "Embedded semiconductor packages and methods thereof" (Japanese, American Inventors)

ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,787, issued on May 27, was assigned to Georgia Tech Research Corp. (Atlanta).

"Embedded semiconductor packages and methods thereof" was invented by Nobuo Ogura (Tokyo), Siddharth Ravichandran (Atlanta), Venkatesh V. Sundaram (Atlanta) and Rao R. Tummala (Atlanta).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor packages and, more particularly, chip-embedded semiconductor packages. The packages include core panels with apertures extending through the core panel. Semiconductor chips are embedded within chip apertures. A molding compound can be positioned along one side of the core panel. The semiconductor chips can be embedded within the mo...