US Patent Issued to General Atomics on Sept. 16 for "Method to manufacture potted electronic assemblies for extreme mechanical and thermal environments" (California, Texas Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,418,991, issued on Sept. 16, was assigned to General Atomics (San Diego).

"Method to manufacture potted electronic assemblies for extreme mechanical and thermal environments" was invented by Walter J. Whatley (San Diego), Noel Martinez (Vista, Calif.) and Clay S. Staley (Murphy, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing potted electronic assemblies are described. Embodiments of the method and system may provide a potting compound having a first coefficient of thermal expansion different from a second coefficient of thermal expansion for a circuit board, provide a fiber reinforcement having a third coefficient of th...