ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,837, issued on April 29, was assigned to Gebr. Schmid GmbH (Freudenstadt, Germany).
"Method of producing printed circuit boards" was invented by Christian Buchner (Baiersbronn, Germany), Jurgen Haungs (Freudenstadt, Germany) and Christian Schmid (Freudenstadt, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a printed circuit board includes providing a base substrate that is a film or plate, has first and second substrate sides and consists partly of an electrically non-conducting organic polymer material, where the first substrate side is covered with a capping metal layer, and regionally removing the capping metal layer,...