ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,795, issued on Jan. 27, was assigned to Ganstronic INC. (Tainan, Taiwan).
"Semiconductor component and semiconductor device" was invented by Cheng-Chuan Chen (Tainan, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor component is provided in the present invention. The semiconductor component includes a substrate, a semiconductor working layer disposed on the substrate, an insulating layer disposed on an upper surface of the semiconductor working layer, plural conducting electrodes, and at least a metal layer floated on the upper surface of the semiconductor working layer and within the insulating layer. The conducting electrodes ...