US Patent Issued to GaNrich Semiconductor on Jan. 28 for "Package structure for a semiconductor element" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. D1,059,315, issued on Jan. 28, was assigned to GaNrich Semiconductor Corp. (Hsinchu, China).

"Package structure for a semiconductor element" was invented by Jia-Tay Kuo (Hsinchu, Taiwan), Chen-Yu Wang (Hsinchu, Taiwan), Sheng-Bo Wang (Hsinchu, Taiwan), Chiao Fu (Hsinchu, Taiwan) and Yao-Zhong Liu (Hsinchu, Taiwan).

The patent was filed on April 27, 2023, under Application No. D/890,845.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1059315&OS=D1059315&RS=D1059315

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