ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,768, issued on Aug. 19, was assigned to GaNrich Semiconductor Corp. (Hsinchu, Taiwan).
"Package structure" was invented by Jia-Tay Kuo (Hsinchu, Taiwan), Chiao Fu (Hsinchu, Taiwan), Sheng-Bo Wang (Hsinchu, Taiwan), Chen-Yu Wang (Hsinchu, Taiwan) and Yao-Zhong Liu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided herein, which includes a substrate, an integrated transistor, and an encapsulation structure. The integrated transistor is disposed on the substrate and includes a transistor, a capacitor, a resistor, a first Zener diode, and a second Zener diode. The transistor includes a gate, a drain, and a so...