ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,616, issued on May 20, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo).
"Semiconductor device" was invented by Masaki Wakaba (Tokyo) and Yasutaka Higa (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a mesa portion that has a semiconductor layered structure, and that extends in a predetermined direction; an extending portion that extends along the mesa portion and that is separated by trench grooves arranged respectively on both sides of the mesa portion; insulating portions that are made from an insulating material, and are arranged in the respective trench grooves; and a conductive portion that is arranged ...