US Patent Issued to FURUKAWA ELECTRIC on July 29 for "Semiconductor-laser-chip-on-submount, manufacturing method thereof, and semiconductor laser module" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,856, issued on July 29, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo).

"Semiconductor-laser-chip-on-submount, manufacturing method thereof, and semiconductor laser module" was invented by Eisaku Kaji (Tokyo) and Yutaka Ohki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor-laser-chip-on-submount includes: a semiconductor laser chip that includes a semiconductor portion having an emitting facet and a rear facet along a longitudinal direction and emits laser light from the emitting facet; and a submount where the semiconductor laser chip is mounted. Further, a first distance between the submount and the emitting facet of the s...