ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,546,542, issued on Feb. 10, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo).
"Vapor chamber and manufacturing method of vapor chamber" was invented by Kengo Tanaka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A vapor chamber which enables to raise the heat transfer coefficient by improving the transport efficiency of the working fluid, and a manufacturing method thereof. A vapor chamber includes a working fluid in a sealed internal space formed by joining a first metal sheet and a second metal sheet, in which in an opposite surface of at least one metal sheet (at least opposite surface 12a in FIGS. 1A and 1B) among opposite surfaces 11a, 12a...