ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,398,957, issued on Aug. 26, was assigned to FURUKAWA ELECTRIC Co. LTD. (Tokyo).
"Heat transport device" was invented by Yosuke Watanabe (Tokyo) and Hirofumi Aoki (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The heat transport device includes a first wick structure provided in the internal space of the first heat transport section, and extending from the evaporation section to the condensation section, a second wick structure provided on an inner surface of the second heat transport section, and extending along the heat transport direction of the second heat transport section, and a reflux promoting body provided on the second wick structure, ex...