US Patent Issued to FUJIMI on Oct. 28 for "CMP slurries" (Oregon Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,454,629, issued on Oct. 28, was assigned to FUJIMI Inc. (Kiyosu, Japan).

"CMP slurries" was invented by Jimmy Granstrom (Tualatin, Ore.) and Hisashi Takeda (Tualatin, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present technology generally relates to compositions and methods for polishing surfaces comprising a metal and a dielectric film material. Embodiments include methods for polishing a surface comprising W, TEOS/SiO2 and SiN, comprising applying a polishing slurry comprising an abrasive, a SiN polishing rate enhancer, and an anionic surfactant, and methods of buffering a metal oxide salt in a CMP slurry to obtain an increased robustness...