US Patent Issued to FUJIMI on Oct. 21 for "Chemical mechanical polishing compositions and methods of use thereof" (Oregon Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,544, issued on Oct. 21, was assigned to FUJIMI Inc. (Aichi, Japan).

"Chemical mechanical polishing compositions and methods of use thereof" was invented by Hooi-Sung Kim (Lake Oswego, Ore.) and Shogo Onishi (Tigard, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to chemical mechanical polishing (CMP) compositions for polishing molybdenum surfaces. In particular, the CMP composition includes an abrasive, a molybdenum (Mo) etching inhibitor, an oxidizer, and water, combined in specified amounts to provide a composition with advantageous properties such as high Mo:TEOS removal rate selectivity and/or high Mo:SiN remo...