US Patent Issued to FUJIMI on March 25 for "Polishing composition, polishing method, and method for manufacturing substrate" (Chinese Inventor)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,258,492, issued on March 25, was assigned to FUJIMI Inc. (Aichi, Japan).

"Polishing composition, polishing method, and method for manufacturing substrate" was invented by Jingzhi Chen (Taiwan, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a polishing composition, a polishing method, and a method for manufacturing a substrate.The polishing composition contains polishing abrasive grains, an additive molecule, a pH adjusting agent, and a dispersing medium. The polishing abrasive grains contain silica particles, and the silanol group density on the surface of the silica particles is 0 to 3.0 groups/nm2. The silanol group density is calc...