US Patent Issued to FUJIMI on Aug. 19 for "Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,391,848, issued on Aug. 19, was assigned to FUJIMI Inc. (Kiyosu, Japan).

"Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate" was invented by Sonosuke Ishiguro (Kiyosu, Japan) and Shogo Onishi (Kiyosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The polishing composition according to the present invention is a polishing composition which contains abrasive grains, an additive, a pH adjusting agent, and a dispersing medium and in which a zeta potential of the abrasive grains is negative, the additive is a crosslinked bicyclic compound having a tertiary nitrogen ato...