US Patent Issued to FUJIMI on April 8 for "Polishing composition, polishing method and method for producing semiconductor substrate" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,970, issued on April 8, was assigned to FUJIMI Inc. (Kiyosu, Japan).

"Polishing composition, polishing method and method for producing semiconductor substrate" was invented by Yukinobu Yoshizaki (Kiyosu, Japan) and Hirofumi Ikawa (Kiyosu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a polishing composition capable of polishing a layer containing an element in group 13 of the periodic table in a content of 40 mass % or more at a high polishing speed. Provided is a polishing composition for use in polishing an object to be polished having a layer containing an element in group 13 of the periodic table in a content of 40 mass % or m...