US Patent Issued to Fujikura on July 8 for "Component-incorporated substrate and method for manufacturing same" (Japanese Inventor)

ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,556, issued on July 8, was assigned to Fujikura Ltd. (Tokyo).

"Component-incorporated substrate and method for manufacturing same" was invented by Masahiro Okamoto (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A component-incorporated substrate of multi-layer structure includes: a first printed wiring base having an opening; a second printed wiring base in a first side of the first printed wiring base; a third printed wiring base in a second side of the first printed wiring base; an electronic component housed in the opening of the first printed wiring base; a via penetrating one or more of the first printed wiring base, the second printed wi...