ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,896, issued on Oct. 14, was assigned to Fujikura Kasei Co. Ltd. (Tokyo).
"Conductive coating material and circuit former" was invented by Katsutomo Wakabayashi (Kuki, Japan), Akinori Naruse (Kuki, Japan) and Yuka Azakami (Kuki, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A conductive coating material includes a silicone resin (A), and a conductive powder (B) at a specific mass ratio, in which the conductive powder (B) includes a flake-shaped conductive powder (B1) having an average particle size of 1 to 7 micro metre and an amorphous conductive powder (B2) having an average particle size of 1 to 6 micro metre at a specific mass ratio, and E...