US Patent Issued to Fujikoshi Machinery on Jan. 28 for "Non-contact apparatus for measuring wafer thickness" (Japanese Inventors)

ALEXANDRIA, Va., Jan. 29 -- United States Patent no. 12,209,853, issued on Jan. 28, was assigned to Fujikoshi Machinery Corp. (Nagano, Japan).

"Non-contact apparatus for measuring wafer thickness" was invented by Chihiro Miyagawa (Nagano, Japan), Kazutaka Shibuya (Nagano, Japan) and Kiyohito Aoki (Nagano, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A non-contact apparatus for measuring wafer thickness includes a monolithic wavelength sweeping semiconductor laser light source having a laser source, a laser control unit that controls the laser source, and a processor to control the laser source to oscillate laser light having a wavelength that changes with a setting profile relative to time; an optica...