US Patent Issued to FUJIFILM on Sept. 23 for "Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,421,343, issued on Sept. 23, was assigned to FUJIFILM Corp. (Tokyo).

"Composition for forming underlayer film for imprinting, method for producing composition for forming underlayer film, kit, pattern producing method, and method for manufacturing semiconductor element" was invented by Akihiro Hakamata (Haibara-gun, Japan), Yuichiro Goto (Haibara-gun, Japan) and Naoya Shimoju (Haibara-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing ...