ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,461, issued on Oct. 7, was assigned to FUJIFILM Corp. (Tokyo).
"Chemical liquid, pattern forming method, and kit" was invented by Takashi Nakamura (Shizuoka, Japan), Tetsuya Kamimura (Shizuoka, Japan) and Satomi Takahashi (Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a chemical liquid which makes it possible to form a thinner resist film having a uniform thickness on a substrate by using a small amount of resist composition and demonstrates excellent defect inhibition performance. Another object of the present invention is to provide a pattern forming method. A chemical liquid of the ...