US Patent Issued to FUJIFILM on Oct. 21 for "Composition for forming thermally conductive material, thermally conductive material, and surface-modified inorganic substance" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,555, issued on Oct. 21, was assigned to FUJIFILM Corp. (Tokyo).

"Composition for forming thermally conductive material, thermally conductive material, and surface-modified inorganic substance" was invented by Daisuke Hayashi (Ashigarakami-gun, Japan), Seiichi Hitomi (Ashigarakami-gun, Japan), Teruki Niori (Ashigarakami-gun, Japan) and Keita Takahashi (Ashigarakami-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a composition for forming a thermally conductive material, from which a thermally conductive material having excellent adhesiveness can be obtained. In addition, the present invention provides a therma...