US Patent Issued to FUJIFILM on Nov. 25 for "Active-light-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, method for manufacturing electronic device, compound, and resin" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,481,215, issued on Nov. 25, was assigned to FUJIFILM Corp. (Tokyo).

"Active-light-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, method for manufacturing electronic device, compound, and resin" was invented by Akira Takada (Shizuoka, Japan), Akiyoshi Goto (Shizuoka, Japan), Masafumi Kojima (Shizuoka, Japan), Aina Ushiyama (Shizuoka, Japan), Michihiro Shirakawa (Shizuoka, Japan), Keita Kato (Shizuoka, Japan), Hironori Oka (Shizuoka, Japan), Mitsuhiro Fujita (Shizuoka, Japan) and Yasuharu Shiraishi (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An actinic ray-sensitive or radiation-sensitive res...