US Patent Issued to FUJIFILM on Nov. 18 for "Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor" (Japanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,403, issued on Nov. 18, was assigned to FUJIFILM Corp. (Tokyo).

"Curable resin composition, cured film, laminate, method for manufacturing cured film, semiconductor device, and polymer precursor" was invented by Atsuyasu Nozaki (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There are provided a curable resin composition containing at least one polymer precursor selected from the group consisting of a polyimide precursor and a polybenzoxazole precursor, where the polymer precursor has a heterocyclic ring structure containing two or more nitrogen atoms and an acid value of the polymer precursor is 1 mmol/g or less, a cured film that i...