US Patent Issued to FUJIFILM on March 4 for "Photosensitive resin composition, method for producing the same, resist film, pattern forming method, and method for manufacturing electronic device" (Japanese Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,242,192, issued on March 4, was assigned to FUJIFILM Corp. (Tokyo).

"Photosensitive resin composition, method for producing the same, resist film, pattern forming method, and method for manufacturing electronic device" was invented by Kei Yamamoto (Shizuoka, Japan), Yasufumi Oishi (Shizuoka, Japan), Naohiro Tango (Shizuoka, Japan) and Hidenori Takahashi (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A photosensitive resin composition including an ethylenically unsaturated compound, a resin having a polarity that increases by the action of an acid, and metal atoms, in which a total content of the metal atoms is from 1 ppt to 30 ppb with ...