US Patent Issued to FUJIFILM on March 18 for "Physical property measurement method, physical property measurement device, and probe" (Japanese Inventors)

ALEXANDRIA, Va., March 19 -- United States Patent no. 12,253,449, issued on March 18, was assigned to FUJIFILM Corp. (Tokyo).

"Physical property measurement method, physical property measurement device, and probe" was invented by Tadashi Kajiya (Kanagawa, Japan), Daisuke Sawai (Kanagawa, Japan), Koji Miyata (Kanagawa, Japan) and Hiroyuki Noda (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a physical property measurement method, a physical property measurement device, and a probe that can simply measure physical properties of a surface layer portion of an object. A physical property measurement method includes a step of bringing a probe into contact with a surface layer portion o...