ALEXANDRIA, Va., March 12 -- United States Patent no. 12,247,300, issued on March 11, was assigned to FUJIFILM Corp. (Tokyo).
"Cleaning solution and cleaning method" was invented by Kohei Hayashi (Shizuoka, Japan) and Tetsuya Kamimura (Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the invention is to provide a cleaning liquid for semiconductor substrates having undergone a chemical mechanical polishing process, the cleaning liquid being excellent in corrosion prevention properties and defect suppression performance with respect to a metal film. Another object of the invention is to provide a method of cleaning semiconductor substrates having undergone a chemical mechanical polis...