US Patent Issued to FUJIFILM on July 29 for "Treatment liquid for manufacturing semiconductor, pattern forming method using the same, and method of manufacturing electronic device using the same" (Japanese Inventors)

ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,873, issued on July 29, was assigned to FUJIFILM Corp. (Tokyo).

"Treatment liquid for manufacturing semiconductor, pattern forming method using the same, and method of manufacturing electronic device using the same" was invented by Tetsuya Shimizu (Shizuoka, Japan) and Tetsuya Kamimura (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention is to provide a treatment liquid for manufacturing a semiconductor, a pattern forming method using the same, and a method of manufacturing an electronic device using the same. The treatment liquid for manufacturing a semiconductor comprising: one kind or two or more kind...