ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,540, issued on July 29, was assigned to FUJIFILM Corp. (Tokyo).
"Post-CMP semiconductor cleaning composition comprising an amine/alkanolamine mixture" was invented by Tetsuya Kamimura (Haibara-gun, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a method of cleaning semiconductor substrates that is excellent in cleaning performance with respect to semiconductor substrates having undergone a chemical mechanical polishing process and corrosion prevention performance with respect to metal films. This method includes a cleaning step of cleaning a semiconductor substrate having undergone the CMP using a cleaning liquid. The cleanin...