ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,868, issued on July 29, was assigned to FUJIFILM Corp. (Tokyo).
"Pattern forming method, kit, and resist composition" was invented by Tetsuya Kamimura (Shizuoka, Japan) and Satomi Takahashi (Shizuoka, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A pattern forming method includes a pre-wetting step of coating a substrate with a chemical liquid so as to obtain a pre-wetted substrate, a resist film forming step of forming a resist film on the pre-wetted substrate by using an actinic ray-sensitive or radiation-sensitive resin composition, an exposure step of exposing the resist film, and a development step of developing the exposed resist film b...