US Patent Issued to FUJIFILM on Dec. 16 for "Composition for forming pattern, kit, pattern producing method, pattern, and method for manufacturing semiconductor element" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,497,469, issued on Dec. 16, was assigned to FUJIFILM Corp. (Tokyo).

"Composition for forming pattern, kit, pattern producing method, pattern, and method for manufacturing semiconductor element" was invented by Yuichiro Goto (Shizuoka, Japan) and Naoya Shimoju (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A composition for forming a pattern for imprinting, which contains a polymerizable compound, a photopolymerization initiator, and an organic halogen compound containing at least one atom selected from the group consisting of a chlorine atom, a bromine atom, and an iodine atom, in which the organic halogen compound is a compound which i...