US Patent Issued to FUJIFILM on Aug. 5 for "Adhesive for endoscope and cured product thereof, and endoscope and method for producing the same" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,378,450, issued on Aug. 5, was assigned to FUJIFILM Corp. (Tokyo).

"Adhesive for endoscope and cured product thereof, and endoscope and method for producing the same" was invented by Kazushi Furukawa (Kanagawa, Japan) and Yoshihiro Nakai (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An object of the present invention to provide an adhesive for an endoscope and a cured product of the adhesive, and an endoscope and a method for producing the endoscope. The adhesive is able to maintain sufficient adhesive strength even when exposed to high temperature for a long time in a state of being used for fixation of a member or subjected to powerfu...