US Patent Issued to FUJIFILM on Aug. 19 for "Pattern forming method, photosensitive resin composition, cured film, laminate, and device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,393,116, issued on Aug. 19, was assigned to FUJIFILM Corp. (Tokyo).

"Pattern forming method, photosensitive resin composition, cured film, laminate, and device" was invented by Kenta Yamazaki (Shizuoka, Japan) and Toshihide Aoshima (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "There is provided a pattern forming method that includes an exposure step of exposing a photosensitive film to laser light; and a development step of developing the photosensitive film after the exposure to obtain a pattern, where the photosensitive film contains at least one precursor selected from the group consisting of a polyimide precursor and a polybenzoxaz...