US Patent Issued to FUJIFILM on Aug. 12 for "Pattern forming method and method for manufacturing electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,386,265, issued on Aug. 12, was assigned to FUJIFILM Corp. (Tokyo).

"Pattern forming method and method for manufacturing electronic device" was invented by Tetsuya Kamimura (Shizuoka, Japan), Tetsuya Shimizu (Shizuoka, Japan) and Satoru Murayama (Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pattern forming method including forming a film using an actinic ray-sensitive or radiation-sensitive resin composition; exposing the formed film; and treating the exposed film using a treatment liquid for manufacturing a semiconductor. The treatment liquid for manufacturing a semiconductor includes a quaternary ammonium compound represented by th...