US Patent Issued to FUJIFILM Business Innovation on April 8 for "Polyimide precursor solution and method for producing porous polyimide film" (Japanese Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,269,948, issued on April 8, was assigned to FUJIFILM Business Innovation Corp. (Tokyo).

"Polyimide precursor solution and method for producing porous polyimide film" was invented by Mieko Seki (Kanagawa, Japan) and Hidekazu Hirose (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polyimide precursor solution contains a polyimide precursor, resin particles having a core and a coating resin layer, the coating resin layer contains a melamine resin, and a solvent."

The patent was filed on May 21, 2021, under Application No. 17/326,364.

*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netac...