US Patent Issued to FUJIBO HOLDINGS on Dec. 16 for "Polishing pad and method for manufacturing polished product" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,496,680, issued on Dec. 16, was assigned to FUJIBO HOLDINGS INC. (Tokyo).

"Polishing pad and method for manufacturing polished product" was invented by Teppei Tateno (Ehime, Japan), Ryuma Matsuoka (Ehime, Japan), Hiroshi Kurihara (Ehime, Japan), Satsuki Narushima (Ehime, Japan) and Yamato Takamizawa (Ehime, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a polishing pad including a polishing layer and a cushion layer, wherein a ratio E'B40/E'C40 of a storage elastic modulus at 40deg C. in dynamic viscoelasticity measurement performed under a bending mode condition with a dry state, a frequency of 10 rad/s, and 20 to...