US Patent Issued to Fujian Jinhua Integrated Circuit on Aug. 5 for "Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layout" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 6 -- United States Patent no. 12,381,082, issued on Aug. 5, was assigned to Fujian Jinhua Integrated Circuit Co. Ltd. (Fujian Province, China).

"Semiconductor structure, method for fabricating thereof, and method for fabricating semiconductor layout" was invented by Gang-Yi Lin (Quanzhou, China), Yu-Cheng Tung (Quanzhou, China), Yi-Wang Jhan (Quanzhou, China), Yifei Yan (Quanzhou, China) and Xiaopei Fang (Quanzhou, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating a semiconductor structure includes the following steps. Decomposing a layout to first connection patterns and second connection patterns alternatively arranged with each other, where a to-be-split p...